Monday 23 April 2018

FCCL Market: Latest Trend, Forecast and Analysis

Report Sellers has added a new market research report “Global FCCL Market Outlook 2017-2022 to its offerings. The report is an in-depth market study providing accurate market insights including the latest trends, forecast, competitive insights, etc.

FCCL is a substrate mainly used for processing flexible printed circuit board (FPC). And it is divided into two categories: the traditional three-layer soft board substrate (3L FCCL) containing adhesive and the new two-layer soft board substrate (2L FCCL) contains no adhesive. Apart from features such as excellent dielectric, bond strength, dimensional stability, flexible copper-clad laminate has prominent features as follows: flexible, can be used to dynamic connection; three dimensional wiring, reducing circuitry space.

The report covers forecast and analysis for the FCCL market on a global and regional level. The study provides historic data of 2012-2016 along with a forecast from 2017 to 2022 based on both volumes and revenue. The study includes drivers and restraints for the FCCL market along with the impact they have on the demand over the forecast period. Additionally, the report includes the study of opportunities available in the FCCL market on a global level.

The report has been prepared based on the synthesis, analysis, and interpretation of information about the global FCCL market collected from specialized sources. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. Company overview, financial overview, product portfolio, new project launched, recent development analysis are the parameters included in the profile.

Browse through the complete description and in-depth TOC on “Global FCCL Market”
https://www.reportsellers.com/market-research-report/Global-FCCL-Market-Outlook-2017-2022

The study provides a decisive view on the FCCL market by segmenting the market based on applications. All the application segments have been analyzed based on present and future trends and the market is estimated from 2017 to 2022.


Key Product Types
• Three-layer
• Two-layer

Key Applications
• Communications
• Consumer Electronics
• Industrial Electronics
• Automotive
• Military

Key Regions
• North America
• Europe
• China
• Japan
• Korea
• Taiwan

Key Vendors
• Nippon Steel & Sumikin Chemical
• UBE Industries
• Arisawa Mfg
• Nikkan Industries
• Panasonic
• DuPont
• Doosan
• Hanwha
• Innox Corporation
• SK Innovation
• LS Mtron
• SD Flex
• Taiflex Scientific
• Asia Electronic Material
• ITEQ
• ThinFlex
• AZOTEK
• RCCT Technology
• Microcosm Technology
• Jiujiang Flex
• Guangdong Shengyi
• Grace Electron
• Shandong Laiwu Jinding
• Zhuhai ATEM
• Shenzhen Danbond
• Allstar
• GTS Flexible

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